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LH28F016LL датащи(PDF) 3 Page - Sharp Corporation

номер детали LH28F016LL
подробное описание детали  16M (1M 횞 16, 2M 횞 8) Flash Memory
PDF  29 Pages
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производитель  SHARP [Sharp Corporation]
домашняя страница  http://sharp-world.com/
Logo SHARP - Sharp Corporation

LH28F016LL датащи(HTML) 3 Page - Sharp Corporation

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16M (1M × 16, 2M × 8) Flash Memory
LH28F016LL
3
PIN DESCRIPTION
SYMBOL
TYPE
NAME AND FUNCTION
A
0
INPUT
BYTE-SELECT ADDRESS:
Selects between high and low byte when device is in x8
mode. This address is latched in x8 Data Writes. Not used in x16 mode (i.e., the A
0
input buffer is turned off when BYTE is high).
A
1 - A15
INPUT
WORD-SELECT ADDRESSES:
Select a word within one 64K block. A
6 - A15 selects
1 of 1024 rows, and A
1 - A5 selects 16 of 512 columns. These addresses are
latched during Data Writes.
A
16 - A20
INPUT
BLOCK-SELECT ADDRESSES:
Select 1 of 32 Erase blocks. These addresses are
latched during Data Writes, Erase and Lock-Block operations.
DQ
0 - DQ7
INPUT/OUTPUT
LOW-BYTE DATA BUS:
Inputs data and commands during CUI write cycles.
Outputs array, buffer, identifier or status data in the appropriate Read mode. Floated
when the chip is de-selected or the outputs are disabled.
DQ
8 - DQ15
INPUT/OUTPUT
HIGH-BYTE DATA BUS
: Inputs data during x16 Data-Write operations. Outputs
array, buffer or identifier data in the appropriate Read mode; not used for Status
register reads. Floated when the chip is de-selected or the outputs are disabled.
CE
»
0, CE »1
INPUT
CHIP ENABLE INPUTS
: Activate the device’s control logic, input buffers, decoders and
sense amplifiers. With either CE
»
0 or CE »1 high, the device is de-selected and power
consumption reduces to Standby levels upon completion of any current Data-Write or
Erase operations. Both CE
»
0, CE »1 must be low to select the device. All timing
specifications are the same for both signals. Device Selection occurs with the latter
falling edge of CE
»
0 or CE »1. The first rising edge of CE»0 or CE »1 disables the device.
RP
»
INPUT
RESET/POWER-DOWN:
RP
» low places the device in a Deep Power-Down state. All
circuits that burn static power, even those circuits enabled in standby mode, are turned
off. When returning from Deep Power-Down, a recovery time of 5 ns is required to
allow these circuits to power-up for Read mode, and another 395 ns is required to enter
Program or Erase mode. When RP
» goes low, any current or pending WSM operation(s)
are terminated, and the device is reset. All Status registers return to ready (with all
status flags cleared).
OE
»
INPUT
OUTPUT ENABLE:
Gates device data through the output buffers when low. The
outputs float to tri-state off when OE
» is high.
NOTE:
CE
»
X overrides OE », and OE » overrides WE.
WE
INPUT
WRITE ENABLE:
Controls access to the CUI, Page Buffers, Data Queue Registers
and Address Queue Latches. WE is active low, and latches both address and data
(command or array) on its rising edge.
RY
»/BY »
OPEN DRAIN
OUTPUT
READY/BUSY:
Indicates status of the internal WSM. When low, it indicates that the
WSM is busy performing an operation. RY
»/BY » high indicates that the WSM is ready
for new operations (or WSM has completed all pending operations), or Erase is
Suspended, or the device is in deep power-down mode. This output is always active
(i.e., not floated to tri-state off when OE
» or CE »
0, CE »1 are high), except if a RY»/BY »
Pin Disable command is issued.



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