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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ADP151 датащи(PDF) 20 Page - Analog Devices |
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ADP151 датащи(HTML) 20 Page - Analog Devices |
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20 / 24 page  ADP151 Rev. D | Page 20 of 24 PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP151. However, as listed in Table 6, a point of diminishing returns is eventually reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits. Place the input capacitor as close as possible to the VIN and GND pins. Place the output capacitor as close as possible to the VOUT and GND pins. Use of 0402 or 0603 size capacitors and resistors achieves the smallest possible footprint solution on boards where area is limited. Figure 60. Example TSOT PCB Layout Figure 61. Example WLCSP PCB Layout Figure 62. Example LFCSP PCB Layout |
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