8

8 - 9

For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

HMC992LP5E

v01.0811

IF AUTOMATIC GAIN CONTROLLER

(IF-AGC), 50 - 800 MHz

Absolute Maximum Ratings

VDD, DETVDD, DETEN,

DETSET,DETRSSI, AMP1OUT,

AMP2OUT

+5.6 V

VCTRL

-0.6V to VDD+0.6V

ATTN1IN, ATTN2IN Input Power

+20 dBm

AMP1IN RF Input Power

+10 dBm

AMP2IN RF Input Power

+15 dBm

DETOUT Output Current

5 mA

DETIN RF Iput Power

12 dBm

Junction Temperature

125°C

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Continuous Pdiss (T=85 °C)

Derate 78.88 mW/°C above 85 °C

3.16 W

Thermal Resistance (R

(junction to package bottom)

12.68°C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C

ESD Sensitivity (HBM)

Class 1B

Outline Drawing

NOTES:

1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED.

2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.

3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.

4. DIMENSIONS ARE IN INCHES [MILLIMETERS].

5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

6. CHARACTERS TO BE HELVETICA MEDIUM, .025 HIGH, WHITE INK, OR LASER MARK LOCATED APPROX. AS SHOWN.

7. PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL BE 0.25mm MAX.

8. PACKAGE WARP SHALL NOT EXCEED 0.05mm

9. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.

10. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.

Package Information

Part Number

Package Body Material

Lead Finish

MSL Rating

HMC992LP5E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

H992

XXXX

[1] 4-Digit lot number XXXX

[2] Max peak reflow temperature of 260 °C