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SC1565 датащи(PDF) 7 Page - Semtech Corporation |
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SC1565 датащи(HTML) 7 Page - Semtech Corporation |
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7 / 10 page ![]() © 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320 VERY LOW DROPOUT 1.5 AMP REGULATOR WITH ENABLE SC1565 October 3, 2000 7 TYPICAL CHARACTERISTICS (Cont.) 0 1 2 3 4 5 6 7 8 9 10 -50 -25 0 25 50 75 100 125 150 TJ (°C) VIN = 5.5V Off-State Quiescent Current vs. Junction Temperature 500 510 520 530 540 550 560 570 580 590 600 -50 -25 0 25 50 75 100 125 150 TJ (°C) VIN = 3.3V Quiescent Current vs. Junction Temperature APPLICATIONS INFORMATION Introduction The SC1565 is intended for applications such as graphics cards where high current capability and very low dropout voltage are required. It provides a very simple, low cost solution that uses very little pcb real estate. Additional features include an enable pin to al- low for a very low power consumption standby mode, and a fully adjustable output. Component Selection Input capacitor - a 4.7µF ceramic capacitor is recom- mended. This allows for the device being some dis- tance from any bulk capacitance on the rail. Addition- ally, input droop due to load transients is reduced, im- proving load transient response. Additional capaci- tance may be added if required by the application. Output capacitor - a minimum bulk capacitance of 10µF, along with a 0.1µF ceramic decoupling capacitor is recommended. Increasing the bulk capacitance will improve the overall transient response. The use of multiple lower value ceramic capacitors in parallel to achieve the desired bulk capacitance will not cause stability issues. Although designed for use with ce- ramic output capacitors, the SC1565 is extremely toler- ant of output capacitor ESR values and thus will also work comfortably with tantalum output capacitors. External voltage selection resistors - the use of 1% re- sistors, and designing for a current flow ≥ 10µA is rec- ommended to ensure a well regulated output (thus R2 ≤ 120kΩ). Thermal Considerations The power dissipation in the SC1565 is approximately equal to the product of the output current and the input to output voltage differential: The absolute worst-case dissipation is given by: For a typical scenario, VIN = 3.3V ± 5%, VOUT = 2.8V and I O = 1.5A, therefore: VIN (MAX) = 3.465V, VOUT(MIN) = 2.744V and I Q(MAX) = 1.75mA, Thus P D(MAX) = 1.09W . Using this figure, and assuming T A(MAX) = 70°C, we can calculate the maximum thermal impedance allowable to maintain T J ≤ 150°C: This should be achievable for the SO-8 package using pcb copper area to aid in conducting the heat away, such as one square inch of copper connected to the ground pins of the device. The SOT-223 and TO-220 packages would not require heatsinking. Internal ground/power planes and air flow will also assist in re- moving heat. For higher ambient temperatures it may be necessary to use additional copper area. () O D I VOUT VIN P • − ≈ ( ) ) MAX ( Q ) MAX ( ) MAX ( O ) MIN ( ) MAX ( ) MAX ( D I VIN I VOUT VIN P • + • − = () () R TT P CW TH J A MAX JMAX A MAX DMAX ()( ) () () () . ./ − = − = − =° 150 70 109 73 4 |
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