PCA9601DP datasheet(32/32 Pages) NXP

32 / 32 page

NXP Semiconductors

PCA9601

Dual bidirectional bus buffer

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 6 May 2011

Document identifier: PCA9601

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

17. Contents

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

4.1

Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Pinning information . . . . . . . . . . . . . . . . . . . . . . 3

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

Functional description . . . . . . . . . . . . . . . . . . . 4

7.1

Static level offset card side . . . . . . . . . . . . . . . . 4

7.1.1

Fast-mode operation . . . . . . . . . . . . . . . . . . . . 4

7.1.2

Fast-mode Plus operation . . . . . . . . . . . . . . . . 4

7.2

High drive, long distance side. . . . . . . . . . . . . . 5

7.3

Connections to other bus buffers . . . . . . . . . . . 5

7.4

Comparison of PCA9601/PCA9600 and

P82B96 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Application information. . . . . . . . . . . . . . . . . . 13

10.1

Calculating system delays and bus clock

frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

10.2

Negative undershoot below absolute

minimum value . . . . . . . . . . . . . . . . . . . . . . . . 19

10.2.1

Example with questions and answers. . . . . . . 21

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 24

Soldering of SMD packages . . . . . . . . . . . . . . 26

12.1

Introduction to soldering . . . . . . . . . . . . . . . . . 26

12.2

Wave and reflow soldering . . . . . . . . . . . . . . . 26

12.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 26

12.4

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 27

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 29

Legal information. . . . . . . . . . . . . . . . . . . . . . . 30

15.1

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 30

15.2

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

15.3

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

15.4

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Contact information. . . . . . . . . . . . . . . . . . . . . 31

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

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