Switching Diode Array

Steering Diode TVS Array™

S C O T TS DALE DIVISION

MMAD1106 and MMAD1106e3

DESCRIPTION

APPEARANCE

These low capacitance diode arrays are multiple, discrete, isolated junctions

fabricated by a planar process and mounted in a 14-pin package for use as

steering diodes protecting up to eight I/O ports from negative ESD, EFT, or

surge by directing them to ground (pin 14)*. They may also be used in fast

switching core-driver applications. This includes computers and peripheral

equipment such as magnetic cores, thin-film memories, plated-wire

memories, etc., as well as decoding or encoding applications. These arrays

offer many advantages of integrated circuits such as high-density packaging

and improved reliability. This is a result of fewer pick and place operations,

smaller footprint, smaller weight, and elimination of various discrete

packages that may not be as user friendly in PC board mounting. They are

available with either Tin-Lead plating terminations or as RoHS Compliant

with annealed matte-Tin finish by adding an “e3” suffix to the part number.

*See MMAD1105(e3) for directing positive transients to positive side of the

power supply line.

Top Viewing Pin Layout

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

Microsemi

Scottsdale Division

Page 1

Copyright

© 2005

6-28-2005 REV K

FEATURES

APPLICATIONS / BENEFITS

•

8 Diode Array

• Low capacitance steering diode protection for high

frequency data lines

•

Molded 14-Pin SOIC Package

• RS-232 & RS-422 Interface Networks

•

UL 94V-0 Flammability Classification

• Ethernet: 10 Base T

•

Low Capacitance 1.5 pF per diode

• Computer I / O Ports

•

Switching speeds less than 5 ns

• LAN

•

RoHS Compliant devices available by adding “e3” suffix

•

IEC 61000-4 compatible

• Switching Core Drivers

61000-4-2 (ESD): Air 15kV, contact – 8 kV

61000-4-4 (EFT): 40A – 5/50 ns

61000-4-5 (surge): 12A, 8/20

µs

MAXIMUM RATINGS

MECHANICAL AND PACKAGING

• CASE: Void-free transfer molded thermosetting

epoxy body meeting UL94V-0 flammability

classification

• Operating Temperature: -55°C to +150°C

• Storage Temperature: -55°C to +150°C

• Forward Surge Current: 2 Amps (8.3 ms)

• TERMINALS: Tin-Lead or RoHS Compliant

annealed matte-Tin plating solderable per MIL-

STD-750 method 2026

12 Amps (8/20

• Continuous Forward Current: 400 mA (one diode)

• Power Dissipation (P

• MARKING: MSC logo, MMAD1106 or

MMAD1106e3 and date code. Pin #1 is to the left

of the dot or indent on top of package

• Solder Temperatures: 260°C for 10 s (maximum)

• WEIGHT: 0.127 grams (approximate)

• Tape & Reel packaging: 2500 pcs (STANDARD)

• Carrier tube packaging: 55 pcs

ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless otherwise specified

REVERSE

RECOVERY

WORKING

LEAKAGE

CAPACITANCE

FORWARD

FORWARD

LEAKAGE

BREAKDOWN

PEAK

CURRENT

VOLTAGE

VOLTAGE

CURRENT

VOLTAGE

TIME

REVERSE

I

C

V

V

I

R

R

F

F

t

VOLTAGE

@ 0 V

T = 25°C

T = 150°C

I = 10 mA

I = 100 mA

V

V

A

µA

A

µA

pF

rr

ns

F

V

F

V

PART

NUMBER

MIN

MAX

MAX

@V

MAX

@V

TYP

MAX

MAX

MAX

R

R

MMAD1106

90

75

0.200

20

300

20

1.5

5.0

1.00

1.20

MMAD1106e3

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503