LX8940IP datasheet(2/6 Pages) MICROSEMI

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LX8940

PRODUCTION DATA SHEET

Microsemi

Integrated Products Division

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

Page 2

Rev. 1.3a, 2005-11-18

5V Low Dropout Regulator

ABSOLUTE MAXIMUM RATINGS

Input Voltage (VIN)......................................................................................... -15V to 26V

Maximum Operating Junction Temperature .............................................................. 150°C

Storage Temperature Range.........................................................................-65°C to 150°C

Peak Package Solder Reflow Temp. (40 seconds max. exposure) ................. 260°C (+0,-5)

Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to

Ground. Currents are positive into, negative out of specified terminal. Pin numbers refer to

DIL packages only

TH ERMAL DATA

Plastic TO-220 3-Pin

THERMAL RESISTANCE

-JUNCTION TO TAB,

3.0

°C/W

THERMAL RESISTANCE

-JUNCTION TO AMBIENT,

°C/W

Junction Temperature Calculation: TJ = TA + (PD x θJA).

The

θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the

above assume no ambient airflow.

PACKAGE PIN OUT

TAB is GND

GND

Output

Input

P PACKAGE

(Top View)

RoHS / Pb-free 100% matte Tin Lead Finish

RECOMM END E D O P ERATING CONDITIONS

LX8940

Parameter

Symbol

Min

Typ

Max

Units

Input Voltage

VIN

Note 2

Load Current (with adequate heatsinking)

1000

Maximum Line Transient (Load Dump), VO < 5.5V

Input Capacitor (VIN to GND)

0.1

µF

Output Capacitor with ESR of 10Ω max., (VOUT to GND & VSB to GND)

µF

Note 2: VIN(MIN) = 1.2∆V(MAX) See Dropout Voltage Maximum Limit.

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