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LX1745 датащи(PDF) 2 Page - Microsemi Corporation

номер детали LX1745
подробное описание детали  Triple Output Boost ??LED Driver / LCD Bias
PDF  16 Pages
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производитель  MICROSEMI [Microsemi Corporation]
домашняя страница  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

LX1745 датащи(HTML) 2 Page - Microsemi Corporation

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LX1745
PRODUCTION DATASHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Triple Output Boost – LED Driver / LCD Bias
Copyright
© 2000
Rev. 1.2, 2006-02-27
TM
®
ABSOLUTE MAXIMUM RATINGS
Supply Input Voltage ...........................................................................-0.3V to 7V
Feedback Input Voltage (VFBx) ...............................................-0.3V to VIN + 0.3V
Shutdown Input Voltage (VSHDN x) ..........................................-0.3V to VIN + 0.3V
PWM Input Amplitude (ADJx, BRT).....................................-0.3V to VIN + 0.3V
Analog Adjust Input Voltage (VADJx, VBRT)............................-0.3V to VIN + 0.3V
SRC Input Current ................................................................................ 500mARMS
Operating Temperature Range .........................................................-40
°C to 85°C
Maximum Operating Junction Temperature ................................................ 150
°C
Storage Temperature Range...........................................................-65
°C to 150°C
RoHS / Pb-free Peak Package Solder Reflow Temperature
(40 second maximum exposure) ..................................................... 260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
x denotes respective pin designator 1, 2, or 3
TH ERMAL DATA
PW Plastic TSSOP 20-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θ
JA
90
°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The
θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the
above assume no ambient airflow.
PACKAGE PIN OUT
GND
DRV
GND
FB1
REF
BRT
SW1
ADJ1
IN
SRC
1
2
8
7
14
17
20
19
3
5
9
12
18
16
6
4
OVP
CS
15
13
SW2
10
11
SHDN1
LSHDN
SHDN2
LFB
ADJ2
FB2
GND
PW PACKAGE
(Top View)
RoHS / Pb-free 100% Matte Tin Lead Finish



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