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LX1741CLM датащи(PDF) 2 Page - Microsemi Corporation |
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LX1741CLM датащи(HTML) 2 Page - Microsemi Corporation |
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2 / 15 page ![]() Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 Copyright © 2000 Rev. 1.1b, 2005-03-03 LX1741 High Efficiency High Voltage Boost Controller PRODUCTION DATA SHEET I N T E GRA T ED PR ODUC T S ABSOLUTE MAXI MUM RATI NGS Supply Voltage (VCC) .................................................................................... -0.3V to 7.0V Feedback Input Voltage (VFB) ..............................................................-0.3V to VIN + 0.3V Shutdown Input Voltage (VSHDN) ........................................................-0.3V to VIN + 0.3V PWM Input Amplitude .........................................................................-0.3V to VIN + 0.3V Analog Adjust Input Voltage (VADJ).................................................................-0.3V to VIN Source Input Current (ISRC).................................................................................. 0.80 ARMS Operating Junction Temperature................................................................................ 150°C Storage Temperature Range.........................................................................-65°C to 150°C Lead Temperature (Soldering 180 seconds)............................................................... 235°C Peak Package Solder Reflow Temp. (40 seconds max. exposure) ................ 260°C (+0, -5) Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal . TH ERM A L DATA DU Plastic MSOP 8-Pin THERMAL RESISTANCE -JUNCTION TO AMBIENT, θJA 206 °C/W THERMAL RESISTANCE -JUNCTION TO CASE, θJC 39 °C/W LM Plastic MLP 8-Pin THERMAL RESISTANCE -JUNCTION TO AMBIENT, θJA 41 °C/W THERMAL RESISTANCE -JUNCTION TO CASE, θJC 5.2 °C/W Junction Temperature Calculation: TJ = TA + (PD x θJC). The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. PACKAGE PIN OUT 1 2 4 3 5 6 8 7 SRC CS GND IN NDRV FB ADJ SHDN DU PACKAGE (Top View) 4 3 2 1 5 6 7 8 SRC CS GND SHDN NDRV FB IN ADJ LM PACKAGE (Top View) RoHS / Pb-free 100% Matte Tin Lead Finish FUNCTIONAL PIN DESCRIPTION NAME DESCRIPTION IN Unregulated IC Supply Voltage Input – Input range from +1.6V to 6.0V. Bypass with a 1µF or greater capacitor for operation below 2.0V. FB Feedback Input – Connect to a resistive divider network between the output and GND to set the voltage at VFB (see Output Voltage Programming: Application Information). SHDN Active-Low Shutdown Input – A logic low shuts down the device and reduces the supply current to 0.1µA. Connect SHDN to VCC for normal operation. NDRV MOSFET Gate Driver – Connects to an external N-Channel MOSFET. CS Current-Sense Amplifier Input – Connecting a resistor between CS and GND sets the peak inductor current limit. GND Common terminal for ground reference. ADJ An applied PWM Signal Input becomes the internal reference, via an internal filter and gain resistor, thus allowing for a dynamic output voltage adjustment of ±15% (i.e., corresponding to the duty cycle variance). Connecting this pin to ground causes the device to revert to the internal voltage reference (note: refer to figure 8). SRC MOSFET Current Sense Input - Connects to the External N-Channel MOSFET Source. |
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