Data Sheet

9

Rev. 2.5, 2010-10-11

TLE6288R

General Product Characteristics

Attention: Integrated protection functions are designed to prevent IC destruction under fault conditions

described in the data sheet. Fault conditions are considered as “outside” normal operating

range. Protection functions are not designed for continuous repetitive operation.

Figure 3

Test Condition

3.2

Thermal Resistance

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Typ.

Max.

3.2.1

–

3.2.2

1) Not subject to production test, specified by design.

R

thjC

1K/W

2)

2) Channel 1-6 continously turned on, 0.8W power dissipation per channel

3.2.3

Junction to ambient1)

R

thjA

15.5

K/W

2) 3)

3) Specified

R

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70

μm Cu, 2 x 35μm Cu).

Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.

Further informations can be found in Chapter 7.2

12V

40V

10 times

(once/ 30sec)

160ms

350ms