ADP2147 datasheet(4/16 Pages) AD

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ADP2147

Rev. 0 | Page 4 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VIN, EN, VSEL

−0.4 V to +6.5 V

VOUT, SW to GND

−1.0 V to (VIN + 0.2 V)

Temperature Range

Operating Ambient

−40°C to +85°C

Operating Junction

−40°C to +125°C

Storage Temperature

−65°C to +150°C

Lead Temperature Range

−65°C to +150°C

Soldering (10 sec)

300°C

Vapor Phase (60 sec)

215°C

Infrared (15 sec)

220°C

ESD Model

Human Body

±1500 V

Charged Device

±500 V

Machine

±100 V

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. These are stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination.

The ADP2147 can be damaged if the junction temperature limit is

exceeded. Monitoring ambient temperature does not guarantee

that the junction temperature (TJ) is within the specified

temperature limit. In applications with high power dissipation

and poor thermal resistance, the maximum ambient temperature

may need to be derated. In applications with moderate power

dissipation and low printed circuit board (PCB) thermal

resistance, the maximum ambient temperature can exceed the

maximum limit if the junction temperature is within specification

limits. The junction temperature (TJ) of the device is dependent

on the ambient temperature (TA), the power dissipation of the

device (PD), and the junction-to-ambient thermal resistance of the

package (θJA). Maximum junction temperature (TJ) is calculated

from the ambient temperature (TA) and power dissipation (PD)

using the following formula:

TJ = TA + (PD × θJA)

Junction-to-ambient thermal resistance (θJA) of the package is

based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent on

the application and board layout. In applications where high

maximum power dissipation exists, close attention to thermal

board design is required. The value of θJA may vary, depending on

PCB material, layout, and environmental conditions. The specified

values of θJA are based on a 4-layer, 4 in. × 3 in. circuit board. Refer

to JEDEC JESD 51-9 for detailed information pertaining to board

construction. For additional information, see the AN-617

Application Note, MicroCSP™ Wafer Level Chip Scale Package.

ΨJB is the junction-to-board thermal characterization parameter

measured in units of °C/W. The package ΨJB is based on modeling

and calculation using a 4-layer board. The JESD51-12, Guidelines

for Reporting and Using Package Thermal Information, states that

thermal characterization parameters are not the same as thermal

resistances. ΨJB measures the component power flowing through

multiple thermal paths rather than through a single path, which

is the procedure for measuring thermal resistance, θJB. There-

fore, ΨJB thermal paths include convection from the top of the

package as well as radiation from the package, factors that make

ΨJB more useful in real-world applications than θJB. Maximum

junction temperature (TJ) is calculated from the board temperature

(TB) and power dissipation (PD) using the formula:

TJ = TB + (PD × ΨJB)

Refer to JEDEC JESD51-8 and JESD51-12 for more detailed

information about ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

θJA

ΨJB

Unit

6-Ball WLCSP

170

°C/W

ESD CAUTION

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