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BGU7007 датащи(PDF) 3 Page - NXP Semiconductors

номер детали BGU7007
подробное описание детали  SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo
PDF  19 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

BGU7007 датащи(HTML) 3 Page - NXP Semiconductors

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BGU7007
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 20 May 2011
3 of 19
NXP Semiconductors
BGU7007
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo
3.
Ordering information
4.
Marking
5.
Limiting values
[1]
Tsp is the temperature at the soldering point of the emitter lead.
[2]
Due to internal ESD diode protection, the applied voltage should not exceed the specified maximum in
order to avoid excess current.
[3]
The RF input and RF output are AC coupled through internal DC blocking capacitors.
6.
Thermal characteristics
Table 3.
Ordering information
Type number
Package
Name
Description
Version
BGU7007
XSON6
plastic extremely thin small outline package; no leads;
6 terminals; body 1
× 1.45 × 0.5 mm
SOT886
Table 4.
Marking codes
Type number
Marking code
BGU7007
B6
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
RF input AC coupled
−0.5
3.1
V
VENABLE
voltage on pin ENABLE
VCC ≥ 2.5 V
−0.5
3.1
V
VCC < 2.5 V
[2]
−0.5
VCC +0.6 V
VRF_IN
voltage on pin RF_IN
DC
VCC ≥ 3.0 V
[3]
−0.5
3.6
V
VCC < 3.0 V
[2][3]
−0.5
VCC +0.6 V
VRF_OUT
voltage on pin RF_OUT
DC
VCC ≥ 1.8 V
[3]
−0.5
3.6
V
VCC < 1.8 V
[2][3]
−0.5
VCC +1.8 V
Pi
input power
-
0
dBm
Ptot
total power dissipation
Tsp ≤ 130 °C
[1]
55
mW
Tstg
storage temperature
−65
150
°C
Tj
junction temperature
-
150
°C
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-sp)
thermal resistance from junction to solder point
225
K/W



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