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BSP92P датащи(PDF) 2 Page - Infineon Technologies AG |
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BSP92P датащи(HTML) 2 Page - Infineon Technologies AG |
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2 / 8 page ![]() 2007-02-08 Rev 2.4 Page 2 BSP 92 P Thermal Characteristics Parameter Symbol Values Unit min. typ. max. Characteristics Thermal resistance, junction - soldering point (Pin 4) RthJS - 15 25 K/W SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area 1) RthJA - - 80 48 115 70 Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Static Characteristics Drain-source breakdown voltage VGS=0, ID=-250µA V(BR)DSS -250 - - V Gate threshold voltage, VGS = VDS ID=-130µA VGS(th) -1 -1.5 -2 Zero gate voltage drain current VDS=-250V, VGS=0, Tj=25°C VDS=-250V, VGS=0, Tj=150°C IDSS - - -0.1 -10 -0.2 -100 µA Gate-source leakage current VGS=-20V, VDS=0 IGSS - -10 -100 nA Drain-source on-state resistance VGS=-2.8V, ID=-0.025A RDS(on) - 10 20 Ω Drain-source on-state resistance VGS=-4.5V, ID=-0.23A RDS(on) - 8.2 15 Drain-source on-state resistance VGS=-10V, ID=-0.26A RDS(on) - 7.5 12 1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. |
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