MAX16909 datasheet(2/18 Pages) MAXIM

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MAX16909

36V, 220kHz to 1MHz Step-Down Converter

with Low Operating Current

SUP, SUPSW, LX, EN to GND...............................-0.3V to +42V

SUP to SUPSW.....................................................-0.3V to +0.3V

BST to GND...........................................................-0.3V to +47V

BST to LX ...............................................................-0.3V to +6V

OUT to GND..........................................................-0.3V to +12V

FOSC, COMP, BIAS, FSYNC, I.C., PGOOD,

FB to GND............................................................-0.3V to +6V

LX Continuous RMS Current ...................................................4A

Output Short-Circuit Duration....................................Continuous

Continuous Power Dissipation (TA = +70NC)

TSSOP (derate 26.1mW/oC above +70NC) .......... 2088.8mW*

TQFN (derate 28.6mW/oC above +70NC) ............ 2285.7mW*

Operating Temperature Range........................ -40NC to +125NC

Junction Temperature .....................................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ..................................... +260oC

TSSOP

Junction-to-Ambient Thermal Resistance (BJA) .......38.3NC/W

Junction-to-Case Thermal Resistance (BJC) .................3NC/W

TQFN

Junction-to-Ambient Thermal Resistance (BJA) ..........35NC/W

Junction-to-Case Thermal Resistance(BJC) ...............2.7NC/W

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

ELECTRICAL CHARACTERISTICS

(VSUP = VSUPSW = 14V, VEN = 14V, RFOSC = 120kI, TA = TJ = -40NC to +125NC, unless otherwise noted. Typical values are at

TA = +25NC.)

*As per the JEDEC 51 standard (multilayer board).

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage Range

VSUP,

VSUPSW

3.5

Load-Dump Event Supply

Voltage

VSUP_LD

tLD < 1s

Supply Current

ISUP

ILOAD = 1.5A

3.5

ISUP_STANDBY

Standby mode, no load, VOUT = 5V

Standby mode, no load, VOUT = 5V,

TA = +25°C

Shutdown Supply Current

ISHDN

VEN = 0V

BIAS Regulator Voltage

VBIAS

VSUP = VSUPSW = 6V to 36V

4.7

5.3

BIAS Undervoltage Lockout

VUVBIAS

VBIAS rising

2.9

3.1

3.3

BIAS Undervoltage-Lockout

Hysteresis

400

Thermal-Shutdown Threshold

+175

Thermal-Shutdown Threshold

Hysteresis

OUTPUT VOLTAGE (OUT)

Output Voltage

VOUT

VFB = VBIAS, normal operation

4.925

5.075

*The parametric values (min, typ, max limits) shown in the Electrical Characteristics table supersede values quoted elsewhere in this data sheet.

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