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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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CYWUSB6953 датащи(PDF) 66 Page - Cypress Semiconductor |
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CYWUSB6953 датащи(HTML) 66 Page - Cypress Semiconductor |
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66 / 68 page  CYRF69103 Document #: 001-07611 Rev *F Page 66 of 68 28. Package Handling Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving the factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this moisture.The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure time may degrade device reliability. 29. Package Diagram Figure 29-1. 40-Pin Pb-Free QFN 6x6 mm 27. Ordering Information Package Ordering Part Number 40-Pin Pb-Free QFN 6x6 mm CYRF69103-40LFXC Table 28-1. Package Handling Parameter Description Min Typ Max Unit TBAKETEMP Bake Temperature 125 see package label °C TBAKETIME Bake Time see package label 72 hours 001-12917 *B [+] Feedback |
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