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33899 датащи(PDF) 5 Page - Freescale Semiconductor, Inc |
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33899 датащи(HTML) 5 Page - Freescale Semiconductor, Inc |
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5 / 26 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 5 33899 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit ELECTRICAL RATINGS Protected Power Supply Voltage VIGNP -0.3 to 40 V Logic Supply Voltage VCC -0.3 to 7.0 V Logic Output Bias Voltage VDDQ -0.3 to 7.0 V VCCL Supply Voltage VCCL -0.3 to 5.0 V Input/Output Voltage (FWD, REV, EN1, EN2, PWM, CS, DI, SCLK, DO, CSNS, LSCMP, RS, REDIS) VI/O -0.3 to 7.0 V Motor Outputs VS0, VS1 -0.5 to 40 V Charge Pump Voltage VCRES -0.3 to 50 V ESD Voltage(1) Human Body Model Machine Model VESD1 VESD2 ±1500 ±200 V THERMAL RATINGS Operating Temperature(2) Ambient Junction TA TJ -40 to 125 -40 to 150 °C Storage Temperature TSTG -65 to 150 °C Thermal Resistance, Junction to Ambient(3) RθJA 18 °C/W Thermal Resistance, Junction to Case (Exposed Pad) RθJC <0.5 °C/W Peak Package Reflow Temperature During Solder Mounting(4) TSOLDER 220 °C Notes 1. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). 2. The junction temperature is the primary limiting parameter. The module thermal design must provide a low enough thermal impedance to keep the junction temperature within limits for all anticipated power levels and ambient temperatures. 3. RθJA is referenced to the JEDEC standard 2s2p thermal evaluation board at 1W total device power dissipation in still air. Deviations from this standard will produce corresponding changes in the actual thermal performance. 4. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. |
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