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ZXTP03200BZ датащи(PDF) 2 Page - Diodes Incorporated |
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ZXTP03200BZ датащи(HTML) 2 Page - Diodes Incorporated |
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2 / 7 page ![]() ZXTP03200BZ Document Number DS31902 Rev. 2 - 2 2 of 7 www.diodes.com August 2009 © Diodes Incorporated A Product Line of Diodes Incorporated ZXTP03200BZ 20 0V P N P LO W V CE(sat) TRAN SIST OR IN SOT -89 Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Collector-Base Voltage VCBO -220 V Collector-Emitter Voltage VCEO -200 V Emitter-Base Voltage VEBO -7 V Continuous Collector Current (Note a) IC -2 A Base Current IB -1 A Peak Pulse Current ICM -5 A Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation at TA = 25°C (Note a) Linear derating factor PD 1.1 8.8 W mW / °C Power Dissipation at TA = 25°C (Note b) Linear derating factor PD 1.8 14.4 W mW / °C Power Dissipation at TA = 25°C (Note c) Linear derating factor PD 2.4 19.2 W mW / °C Power Dissipation at TA = 25°C (Note d) Linear derating factor PD 4.46 35.7 W mW / °C Power Dissipation at TA = 25°C (Note e) Linear derating factor PD 38.7 309.6 W mW / °C Junction to Ambient (Note a) RθJA 117 °C/W Junction to Ambient (Note b) RθJA 68 °C/W Junction to Ambient (Note c) RθJA 51 °C/W Junction to Ambient (Note d) RθJA 28 °C/W Junction to Lead (Note e) RθJL 3.23 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Notes: a. For a device surface mounted on 15mm X 15mm X 1.6mm FR4 PCB with high coverage of single sided 1 oz copper, in still air conditions b. Mounted on 25mm X 25mm X 1.6mm FR4 PCB with high coverage of single sided 1 oz copper, in still air conditions. c. Mounted on 25mm X 25mm X 1.6mm FR4 PCB with high coverage of single sided 2 oz copper, in still air conditions. d. As (c) above measured at t<5 seconds e. Junction to lead from collector Tab. Typical |
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