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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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LT3083MPFE датащи(PDF) 25 Page - Linear Technology |
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LT3083MPFE датащи(HTML) 25 Page - Linear Technology |
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25 / 28 page  LT3083 25 3083f PACKAGE DESCRIPTION DF Package 12-Lead Plastic DFN (4mm × 4mm) (Reference LTC DWG # 05-08-1733 Rev Ø) 4.00 0.10 (4 SIDES) NOTE: 1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE PIN 1 TOP MARK (NOTE 6) 0.40 0.10 1 6 12 7 BOTTOM VIEW—EXPOSED PAD 2.65 0.10 0.75 0.05 R = 0.115 TYP 0.25 0.05 0.50 BSC 2.50 REF 3.38 0.10 0.200 REF 0.00 – 0.05 (DF12) DFN 0806 REV Ø RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 0.70 0.05 0.25 0.05 0.50 BSC 3.10 0.05 4.50 0.05 PACKAGE OUTLINE PIN 1 NOTCH R = 0.20 TYP OR 0.35 45 CHAMFER 2.65 0.05 3.38 0.05 2.50 REF |
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