Micrel Inc.

MIC2267

January 2011

2

M9999-011711-A

Ordering Information

Part Number

Voltage

Mark Code

Temperature Range

Package

(1)

MIC2267YML

Adjustable

2267

–40°C to +125°C

12-Pin 3mm x 3mm MLF

®

Note:

1. Package is GREEN RoHS compliant. Lead finish is NiPdAu. Mold compound is halogen free.

Pin Configuration

12-Pin 3mm x 3mm MLF

(Top View)

Pin Description

Pin Number

Pin Name

Pin Function

1

AGND

Analog Ground: The ground return for the low power blocks of the MIC2267.

2

FB

Feedback (Input): Input to the error amplifier. Connect a resistor divider between VOUT and

ground to adjust the output voltage.

3

COMP

Compensation Pin: Output of the internal gm error amplifier. Place a series connected,

Resistor and Capacitor to GND for external compensation.

4

PGOOD

Power Good (Output): Open drain of an N-Channel MOSFET. Connect a resistor to VIN or

VOUT for power good signalling.

5

SW

Switch (Output): Internal power MOSFET output switches.

6

PGND

Power Ground: The ground return for the switching currents.

7

VIN

Power Supply Voltage (Input): Requires bypass capacitor to GND

8

EN

Enable/Delay (Input): Apply a Logic High to start the device. Apply Logic Low to stop the

device; placing it in a low quiescent current mode.

9

FILTER

Input Current Limit Filter: Place a capacitor to VIN to adjust the time constant for the input

current limit filter.

10

LIMIT

Input Current Limit: Place a resistor to ground to adjust the average current limit from the input

supply.

11

SLOPEC

Slope Compensation: Sets current mode slope compensation

12

FREQ

Frequency Control: The switching frequency is adjusted from 400kHz to 1.5MHz with a resistor

from this pin to ground.

ePAD

HS Pad

Exposed Heatsink Pad: Thermal connection between die and external ground plane. A solid

connection to a large ground plane is required for full output power. This pad must be

connected to ground.