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ADP1850 датащи(PDF) 5 Page - Analog Devices |
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ADP1850 датащи(HTML) 5 Page - Analog Devices |
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5 / 32 page ![]() ADP1850 Rev. 0 | Page 5 of 32 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating VIN, EN1/EN2, RAMP1/RAMP2 21 V FB1/FB2, COMP1/COMP2, SS1/SS2, TRK1/TRK2, FREQ, SYNC, VCCO, VDL, PGOOD1/PGOOD2 −0.3 V to +6 V ILIM1/ILIM2, SW1/SW2 to PGND1/PGND2 −0.3 V to +21 V BST1/BST2, DH1/DH2 to PGND1/PGND2 −0.3 V to +28 V DL1/DL2 to PGND1/PGND2 −0.3V to VCCO + 0.3 V BST1/BST2 to SW1/SW2 −0.3 V to +6 V BST1/BST2 to PGND1/PGND2 20 ns Transients 32 V SW1/SW2 to PGND1/PGND2 20 ns Transients 25 V DL1/DL2, SW1/SW2, ILIM1/ILIM2 to PGND1/PGND2 20 ns Negative Transients −8 V PGND1/PGND2 to AGND −0.3 V to +0.3 V PGND1/PGND2 to AGND 20 ns Transients −8 V to +4 V θJA on Multilayer PCB (Natural Convection) 1, 2 32.6°C/W Operating Junction Temperature Range3 −40°C to +125°C Storage Temperature Range −65°C to +150°C Maximum Soldering Lead Temperature 260°C 1 Measured with exposed pad attached to PCB. 2 Junction-to-ambient thermal resistance (θJA) of the package was calculated or simulated on multilayer PCB. 3 The junction temperature, TJ, of the device is dependent on the ambient temperature, TA, the power dissipation of the device, PD, and the junction-to- ambient thermal resistance of the package, θJA. Maximum junction temperature is calculated from the ambient temperature and power dissipation using the formula: TJ = TA + PD × θJA. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all other voltages are referenced to GND. ESD CAUTION |
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