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Document Number: 81182

4

Rev. 1.0, 03-Feb-10

VLSL30

PCB BASIC DESIGN Dimensions in millimeters

Board design with 4 parallel LED rows (4 cathode pads and common anode pad)

PCB CHARACTERISTICS

• Metal core PCB with typical Cu thickness of 800 μm

• Prepreg type R1566 typical 127 μm

• Conductive pattern Cu typical 25 μm

• Total board thickness: 1 mm ± 15 %

• Warpage max. 0.75 % of board dimension

• Solder resist on top side

• Shiny white surface

• Galvanic of solder pads and backside pure matte Sn (

≥ 0.8 μm),

board edges and hole walls immersion plated

• Assembled with 24 VLMW711xxx LED’s. LED position

accuracy ± 0.125 mm from middle axis, horizontal tilt max. 2°

21854

Drawing-No.: 9.920-6715.01-4

Issue: 1; 28.09.09

Not indicated tolerances ± 0.15 mm

121

3 x 20 = 60

30.5 ± 0.35

8

20

16

(20.5)

20

20

20

20

20.5

89

16

6.2

24 x

Ø 0.25

Fiducial mark (3 x)

Ø 3.5 ± 0.05 (13 x)

2.6

1

specifications

according to DIN

technical drawings