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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STTS751 датащи(PDF) 24 Page - STMicroelectronics |
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STTS751 датащи(HTML) 24 Page - STMicroelectronics |
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24 / 36 page  Maximum ratings STTS751 24/36 Doc ID 16483 Rev 5 7 Maximum ratings Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 26. Absolute maximum ratings Symbol Parameter Value Unit TSTG Storage temperature (VDD off) –55 to 150 °C TSLD (1) 1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds. Lead solder temperature 260 °C VIO Input or output voltage –0.3 to VDD + 0.3 V VDD Supply voltage 5.0 V IO Output current 20 mA θJA Thermal resistance (junction to ambient) UDFN-6L 78 °C/W SOT23-6L 191 |
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