13

4957H–AUTO–05/10

ATA6623/ATA6625

7.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating

only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this

specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Parameters

Symbol

Min.

Typ.

Max.

Unit

Supply voltage V

S

V

S

–0.3

+40

V

Pulse time

≤ 500 ms

T

V

S

+40

V

Pulse time

≤ 2min

T

Output current I

V

S

27

V

Logic pins (RxD, TxD, EN, NRES)

–0.3

+5.5

V

Output current NRES

I

NRES

+2

mA

LIN

- DC voltage

–27

+40

V

- DC voltage

–0.3

+5.5

V

ESD according to IBEE LIN EMC

Test specification 1.0 following IEC 61000-4-2

- Pin VS, LIN to GND

±6

KV

ESD HBM following STM5.1

with 1.5 k

Ω/100 pF

- Pin VS, LIN to GND

±6

KV

HBM ESD

ANSI/ESD-STM5.1

JESD22-A114

AEC-Q100 (002)

±3

KV

CDM ESD STM 5.3.1

±750

V

Machine Model ESD

AEC-Q100-RevF(003)

±200

V

Junction temperature

–40

+150

°C

Storage temperature

–55

+150

°C

8.

Thermal Characteristics

Parameters

Symbol

Min.

Typ.

Max.

Unit

Thermal resistance junction to ambient

(free air)

145

K/W

Special heat sink at GND (pin 3) on PCB

80

K/W

150

160

170

°C

Thermal shutdown of LIN output

150

160

170

°C

Thermal shutdown hysteresis

10

°C