BAV99DW

Document number: DS30145 Rev. 13 - 2

1 of 3

www.diodes.com

January 2009

© Diodes Incorporated

BAV99DW

SURFACE MOUNT SWITCHING DIODE ARRAY

Features

•

Fast Switching Speed

•

Ultra-Small Surface Mount Package

•

For General Purpose Switching Applications

•

High Conductance

•

Two “BAV99” Circuits In One Package

•

Lead Free/RoHS Compliant (Note 3)

•

Qualified to AEC-Q101 Standards for High Reliability

•

"Green" Device (Notes 4 and 5)

Mechanical Data

•

Case: SOT-363

•

Case Material: Molded Plastic, “Green” Molding Compound

(Note 5). UL Flammability Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020D

•

Terminals: Matte Tin Finish annealed over Alloy 42 leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

•

Polarity: See Diagram

•

Marking Information: See Page 2

•

Ordering Information: See Page 2

•

Weight: 0.006 grams (approximate)

Characteristic

Symbol

Value

Unit

Non-Repetitive Peak Reverse Voltage

100

V

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

75

V

RMS Reverse Voltage

53

V

Forward Continuous Current

(Note 1)

215

mA

Non-Repetitive Peak Forward Surge Current

@ t = 1.0

μs

@ t = 1.0ms

@ t = 1.0s

2.0

1.0

0.5

A

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation

(Note 1)

200

mW

Power Dissipation

(Note 2)

300

mW

Thermal Resistance Junction to Ambient Air

(Note 1)

625

°C/W

Thermal Resistance Junction to Ambient Air

(Note 2)

417

°C/W

Operating and Storage Temperature Range

-65 to +150

°C

Characteristic

Symbol

Min

Max

Unit

Test Condition

Reverse Breakdown Voltage (Note 6)

75

⎯

V

Forward Voltage

⎯

0.715

0.855

1.0

1.25

V

Reverse Current (Note 6)

⎯

2.5

50

30

25

μA

μA

μA

nA

Total Capacitance

⎯

2.0

pF

Reverse Recovery Time

⎯

4.0

ns

Notes:

1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout

document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2. Device mounted on Alumina PCB, 0.4 inch x 0.3 inch x 0.024 inch; pad layout as shown on Diodes Inc. suggested pad layout

document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

3. No purposefully added lead.

4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

6. Short duration pulse test used to minimize self-heating effect.

TOP VIEW

SOT-363

Internal Schematic

TOP VIEW

AC

1

AC

2

A

1

A

2

C

1

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