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LM3464AMH датащи(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
номер детали LM3464AMH
подробное описание детали  LED Driver with Dynamic Headroom Control and Thermal Control Interfaces
PDF  22 Pages
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производитель  NSC [National Semiconductor (TI)]
домашняя страница  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM3464AMH датащи(HTML) 4 Page - National Semiconductor (TI)

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Pin
Name
Description
Application Information
20
SE4
Channel 4 sense input
Connect to an external sense resistor to define the Channel 4
LED current.
21
GD4
Channel 4 gate driver output
Connect to the gate of external NMOS to control the channel
4 LED current.
22
PGND
Power Ground
Ground for power circuitry. Reference point for all stated
voltages. Must be externally connected to EP and AGND
23
GD3
Channel 3 gate driver output
Connect to the gate of external NMOS to control the channel
3 LED current.
24
SE3
Channel 3 sense input
Connect to an external sense resistor to define the Channel 3
LED current.
25
GD2
Channel 2 gate driver output
Connect to the gate of external NMOS to control the channel
2 LED current.
26
SE2
Channel 2 sense input
Connect to an external sense resistor to define the Channel 2
LED current.
27
GD1
Channel 1 gate driver output
Connect to the gate of external NMOS to control the channel
1 LED current.
28
SE1
Channel 1 sense input
Connect to an external sense resistor to define the Channel 1
LED current.
EP
EP
Thermal Pad (Power Ground)
Used to dissipate heat from the package during operation.
Must be electrically connected to PGND external to the
package.
www.national.com
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