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LM3464 датащи(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
номер детали LM3464
подробное описание детали  LED Driver with Dynamic Headroom Control and Thermal Control Interfaces
PDF  22 Pages
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производитель  NSC [National Semiconductor (TI)]
домашняя страница  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM3464 датащи(HTML) 4 Page - National Semiconductor (TI)

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Pin
Name
Description
Application Information
20
SE4
Channel 4 sense input
Connect to an external sense resistor to define the Channel 4
LED current.
21
GD4
Channel 4 gate driver output
Connect to the gate of external NMOS to control the channel
4 LED current.
22
PGND
Power Ground
Ground for power circuitry. Reference point for all stated
voltages. Must be externally connected to EP and AGND
23
GD3
Channel 3 gate driver output
Connect to the gate of external NMOS to control the channel
3 LED current.
24
SE3
Channel 3 sense input
Connect to an external sense resistor to define the Channel 3
LED current.
25
GD2
Channel 2 gate driver output
Connect to the gate of external NMOS to control the channel
2 LED current.
26
SE2
Channel 2 sense input
Connect to an external sense resistor to define the Channel 2
LED current.
27
GD1
Channel 1 gate driver output
Connect to the gate of external NMOS to control the channel
1 LED current.
28
SE1
Channel 1 sense input
Connect to an external sense resistor to define the Channel 1
LED current.
EP
EP
Thermal Pad (Power Ground)
Used to dissipate heat from the package during operation.
Must be electrically connected to PGND external to the
package.
www.national.com
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