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AP131 датащи(PDF) 4 Page - Diodes Incorporated

номер детали AP131
подробное описание детали  300mA LOW DROPOUT LINEAR REGULATOR WITH
PDF  7 Pages
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производитель  DIODES [Diodes Incorporated]
домашняя страница  http://www.diodes.com
Logo DIODES - Diodes Incorporated

AP131 датащи(HTML) 4 Page - Diodes Incorporated

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AP131
300mA LOW DROPOUT LINEAR REGULATOR WITH
SHUTDOWN
AP131 Rev. 7
4 of 7
FEBRUARY 2009
www.diodes.com
© Diodes Incorporated
Electrical Characteristics
TA = 25ºC, CIN = 1µF, COUT = 10µF, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ.
Max
Unit
VDROP
Dropout Voltage (Note 3)
IL = 300mA
-
400
500
mV
ILIMIT
Current Limit (Note 4)
VIN = 5V, VOUT = 0V
350
450
-
mA
Ishort
Short Circuit Current
VOUT < 1.05V
-
150
300
mA
ΔV
LINE
Line Regulation
IOUT=1mA, VIN =( VOUT +1V )
to 5.5V
-
0.1
0.3
%/V
ΔV
LOAD
Load Regulation (Note 5)
IL = 1~300mA, VIN = 5V
-
30
35
mV
ΔV
OUT
Output Voltage Accuracy
IL = 1mA, VIN = 5V
-2
-
+2
%
Output Voltage Temperature
Coefficient (Note 6)
-
50
150
PPM/
ºC
PSRR
Ripple Rejection
F = 100Hz,
CIN = 1μF, CO = 10uF,
IL = 100mA
-
60
-
dB
ISB
Standby Current
IL = 0mA, VIN = 5V, EN = 0V
-
-
5
μA
IQ
Quiescent Current
IL = 0mA, VIN = 5V, EN = 5V
-
50
100
μA
IEN
Enable Pin Current
-
-
< 0.1
μA
VENON
Enable Pin Voltage
Output ON
1.5
-
VIN
V
VENOFF
Output OFF
0
-
0.8
V
TDELAY
Enable Delay Time
CBP = 0.1μF, COUT = 1μF,
IOUT = 30mA
-
8
-
μS
θ
JA
Thermal Resistance
Junction-to-Ambient
SOT25 (Note 7)
163
OC/W
θ
JC
Thermal Resistance
Junction-to-Case
SOT25 (Note 7)
53
OC/W
Notes:
3. Dropout voltage is defined as the input to output differential voltage. Dropout is measured at constant junction temperature by using pulsed ON
time, and the criterion is VOUT inside target value ±2%. This test is skipped at the condition of VIN<3V.
4. Current limit is measured at constant junction temperature by using pulsed testing with a low ON time.
5. Regulation is measured at constant junction temperature by using pulsed testing with a low ON time.
6. Guaranteed by design.
7. Test conditions for SOT25: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.



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