ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 38

6 of 12

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Suggested Pad Layout

© Diodes Incorporated

PowerDI

PowerDI

G

X

C

Y1

(2x)

Y

X1

(2x)

X1

GX2

Y2

Y1

Dimensions

Value (in mm)

C

1.840

G

0.852

X

3.360

X1

1.390

Y

4.860

Y1

1.400

Dimensions

PowerDI

G

1.0

0.5

X1

2.2

2.0

X2

0.9

0.8

Y1

1.4

0.8

Y2

1.4

1.1

PowerDI3333-8

PowerDI5060-8

X

Y

Y1

Y3

Y2

X2

C

14

85

G

G1

X

X1

Y

Y1

Y2

G1

Y3 (4x)

X2 (8x)

G

C

Dimensions

Value (in mm)

C

0.650

G

0.230

G1

0.420

Y

3.700

Y1

2.250

Y2

1.850

Y3

0.700

X

2.370

X2

0.420

Dimensions

Value (in mm)

C

1.270

G

0.660

G1

0.820

X

4.420

X1

4.100

X2

0.610

Y

6.610

Y1

3.810

Y2

1.020

Y3

1.270