AL3158

HIGH EFFICIENCY 1x/2x CHARGE PUMP

FOR WHITE LED APPLICATIONS

AL3158

Document number: DS35047 Rev. 2 - 2

3 of 10

www.diodes.com

January 2011

© Diodes Incorporated

Symbol

Description

Rating

Unit

ESD HBM

Human Body Model ESD Protection

2

KV

ESD MM

Machine Model ESD Protection

200

V

Input Voltage

-0.3 to 6

V

EN1, EN2, EN3 to GND Voltage

V

Maximum DC Output Current

270

mA

Operating Junction Temperature Range

150

°C

Maximum Soldering Temperature (at leads, 10 sec)

300

°C

Notes:

2. Exceeding Absolute Maximum Ratings will cause permanent damage to the device.

Recommended Operating Conditions

Symbol

Parameter

Min

Max

Unit

Input Voltage

2.7

5.5

V

Operating Ambient Temperature

-40

85

°C

Symbol

Parameter

Test Conditions

Min

Typ.

Max

Unit

Quiescent Current

No Load Current

0.3

0.6

mA

No Load Current

2

5

Shutdown Current

EN1, EN2, EN3 = 0

1

µA

19

20

21

mA

Current Matching Between Any Two

Current Sink Inputs (Note 4)

1

2

%

1x mode

0.5

Ω

2 x mode

4.5

1x to 2x Transition Threshold at Any

150

mV

Mode Transition Hysteresis

250

mV

Soft-Start Time

100

µs

Fsw

Switching Frequency

1.2

MHz

EN1,2,3 Threshold Low

0.4

V

EN1,2,3 Threshold High

1.4

V

EN1,2,3 Off Timeout

20

ms

UVLO

1.8

2

2.2

V

EN1,2,3 Input Leakage

-1

1

µA

Thermal shutdown Protection

160

°C

Thermal shutdown hysteresis

10

°C

Thermal Resistance Junction-to-

Ambient

QFN3030-20 (Note 5)

52

Notes: 3. Determined by the average current levels of all active channels.

4. Determined by the maximum sink current (MAX), the minimum sink current (MIN), and the average sink current (AVG). Two matching numbers are

calculated as (MAX-AVG)/AVG and (AVG-MIN)/AVG. The largest number of the two (worst case) is considered as the matching data.

5. Device mounted on FR-4 substrate, 2"*2", 2oz copper, double-sided PC board, with minimum recommended pad on top layer and

4 vias to bottom layer.