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RU82566DM датащи(PDF) 21 Page - Intel Corporation

номер детали RU82566DM
подробное описание детали  82566 Gigabit Platform LAN Connect
PDF  30 Pages
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производитель  INTEL [Intel Corporation]
домашняя страница  http://www.intel.com
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RU82566DM датащи(HTML) 21 Page - Intel Corporation

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82566 Gigabit Platform LAN Connect Networking Silicon Datasheet
17
3.5.2.6
PNP Transistor Specification for 1.0V DC LVR
3.5.3
Crystal
Table 21 lists the recommended crystal specifications for operation with the 82566.
Table 20. PNP Specification for 1.0V DC LVR
PNP
Connection
Description
Symbol
Min
Typ
Max
Units
PNP
Transistor for
1.0V DC LVR
dc Gaina
a. Vce = -1.0 V DC; Ic = 0.5 A; T = 25
°C.
β
60
-
400
-
Transition Frequency
fT
-
40
-
MHz
Thermal Resistance Junction to
Ambientb
b. The thermal resistance feature depends on the PNP package along with the board layout including: number of layers, layer
thickness, copper area for collector pad, and component locations.
Rt_ja
-
-
60
°C/W
Maximum Operation Junction
Temperature
Tj_max
-
-
150
°C
Maximum Collector Current
Ic_max
-
-
1
A
Maximum Power Dissipationc
c.
Ta = 70
°C; Vin = 3.6 V DC; Vout = 0.95 V DC; I = 0.4 A
Pmax
-
-
1.1
W
Table 21. Crystal Specifications (Sheet 1 of 2)
Parameter Name
Symbol
Recommended Value
Max/Min Range
Conditions
Frequency
fo
25.000 MHz
-
@25 °C
Vibration mode
-
Fundamental
-
-
Cut
-
AT
-
-
Operating/Calibration
Mode
-
Parallel
-
-
Frequency Tolerance
∆f/fo @25°C
±30 ppm
a
@25 °C
Temperature Tolerance
∆f/fo
±30 ppm
a
-
Operating Temperature
Topr
-20 to +70 °C
a
-
Non Operating
Temperature
Topr
-40 to +90 °C
-
-
Equivalent Series
Resistance (ESR)
Rs
10
Ω
50
Ω
@25 MHz
Load Capacitance
Cload
20 pF (max 24 pF)
a
-
Shunt Capacitance
Co
6 pF
a
-
Pullability from Nominal
Load Capacitance
∆f/Cload
15 ppm/pF max
-
-
Max Drive Level
DL
500
µW-
-
Insulation Resistance
IR
500 M
Ω min
@ 100V DC
Aging
∆f/fo
±5 ppm per year
±5 ppm per year
-



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