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MPC5604B датащи(PDF) 39 Page - Freescale Semiconductor, Inc

номер детали MPC5604B
подробное описание детали  32-bit MCU family built on the Power Architecture for automotive
PDF  106 Pages
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производитель  FREESCALE [Freescale Semiconductor, Inc]
домашняя страница  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC5604B датащи(HTML) 39 Page - Freescale Semiconductor, Inc

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Electrical characteristics
MPC5604B/C Microcontroller Data Sheet, Rev. 8
Freescale Semiconductor
39
JC
CC
D
Junction-to-case thermal
characterization parameter,
natural convection
Single-layer board - 1s
64
TBD
°C/W
100
9
144
10
Four-layer board - 2s2p
64
TBD
100
9
144
10
1 Thermal characteristics are based on simulation.
2 V
DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = -40 to 125 °C
3 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test
board meets JEDEC specification for this package.
4 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
5 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface
layer.
Table 10. LQFP thermal characteristics1 (continued)
Symbol
C
Parameter
Conditions2
Pin count
Value
Unit



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