MPX4080D

Sensors

4

Freescale Semiconductor

Pressure

On-Chip Temperature Compensation and Calibration

differential pressure input. Typical, minimum, and maximum

output curves are shown for operation over a temperature

range of 0

° to 85°C using the decoupling circuit shown in

pressure range.

chip carrier (Case 867). A fluorosilicone gel isolates the die

surface and wire bonds from the environment, while allowing

the pressure signal to be transmitted to the sensor

diaphragm.

The MPX4080D pressure sensor operating

characteristics, internal reliability, and qualification tests are

based on use of dry air as the pressure media. Media, other

than dry air, may have adverse effects on sensor

performance and long-term reliability. Contact the factory for

information regarding media compatibility in your application.

interfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

Figure 2. Output versus Pressure Differential

Figure 3. Cross-Sectional Diagrams (not to scale)

Figure 4. Recommended Power Supply Decoupling and Output Filter

(For additional output filtering information, refer to Application Note AN1646.)

4.5

4

3.5

3

2.5

2

1.5

1

0.5

0

TYP

MAX

MIN

Offset

(TYP)

010

40

60

80

kPa

PSI

20

30

50

70

VS = 5.1 Vdc

TA = 25°C

MPX4080

5

Pressure (kPa)

Lead Frame

Wire Bond

Die

Fluoro Silicone

Gel Die Coat

Differential/Gauge

Bond

Die

Epoxy Plastic

Case

Stainless Steel

Metal Cover

Element

Vs

1.0 µF

470 pF

OUTPUT

+5.0 V

0.01 µF

GND

IPS