BSP135 datasheet(2/9 Pages) INFINEON

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BSP135

Parameter

Symbol Conditions

Unit

min.

typ.

max.

Thermal characteristics

Thermal resistance,

junction - soldering point (pin 4)

R thJS

K/W

SMD version, device on PCB

R thJA

minimal footprint

115

6 cm

2 cooling area2)

Electrical characteristics, at T j=25 °C, unless otherwise specified

Static characteristics

Drain-source breakdown voltage

V (BR)DSS V GS=-3 V, I D=250 µA

600

Gate threshold voltage

V GS(th)

V DS=3 V, I D=94 µA

-2.1

-1.4

-1

Drain-source cutoff current

I D(off)

V DS=600 V,

V GS=-3 V, T j=25 °C

0.1

µA

V DS=600 V,

V GS=-3 V, T j=125 °C

Gate-source leakage current

I GSS

V GS=20 V, V DS=0 V

100

On-state drain current

I DSS

V GS=0 V, V DS=10 V

Drain-source on-state resistance

R DS(on)

V GS=0 V, I D=0.01A

-30

Ω

V GS=10 V, I D=0.12 A

-25

Transconductance

g fs

|V DS|>2|I D|R DS(on)max,

I D=0.1 A

0.08

0.16

Threshold voltage V GS(th) sorted in bands

V GS(th)

V DS=3 V, I D=94 µA

-1.2

-1

-1.35

-1.15

-1.5

-1.3

-1.65

-1.45

-1.8

-1.6

drain connection. PCB is vertical in still air.

3) Each reel contains transistors out of one band whose identifying letter is printed on the reel label. A specific

band cannot be ordered separately.

Values

2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (single layer, 70 µm thick) copper area for

Rev. 1.3

page 2

10-07-19

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