2007-09-19

22

BAS70.../BAS170W

Package TSLP-2-1

Reel ø180 mm = 15.000 Pieces/Reel

Reel ø330 mm = 50.000 Pieces/Reel (optional)

For board assembly information please refer to Infineon website "Packages"

1

2

0.45

Copper

Solder mask

Stencil apertures

0.6

BAS16-02L

Type code

Cathode marking

Laser marking

0.76

4

0.5

Cathode

marking

Package Outline

Foot Print

Marking Layout (Example)

Standard Packing

0.4

0.05 MAX.

+0.1

Cathode

marking

1) Dimension applies to plated terminal

Top view

Bottom view

1

2

1)

±0.035

0.5

±0.05

0.6