+72V, SOT23/TDFN, Simple Swapper Hot-Swap

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Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are

implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

© 2007 Maxim Integrated Products

is a registered trademark of Maxim Integrated Products, Inc.

H

1

2

21-0137

PACKAGE OUTLINE, 6,8,10 & 14L,

TDFN, EXPOSED PAD, 3x3x0.80 mm

COMMON DIMENSIONS

SYMBOL

MIN.

MAX.

A

0.70

0.80

D

2.90

3.10

E

2.90

3.10

A1

0.00

0.05

L

0.20

0.40

PKG. CODE

N

D2

E2

e

JEDEC SPEC

b

[(N/2)-1] x e

PACKAGE VARIATIONS

0.25 MIN.

k

A2

0.20 REF.

2.30±0.10

1.50±0.10

6

T633-1

0.95 BSC

MO229 / WEEA

1.90 REF

0.40±0.05

1.95 REF

0.30±0.05

0.65 BSC

2.30±0.10

8

T833-1

2.00 REF

0.25±0.05

0.50 BSC

2.30±0.10

10

T1033-1

2.40 REF

0.20±0.05

- - - -

0.40 BSC

1.70±0.10

2.30±0.10

14

T1433-1

1.50±0.10

1.50±0.10

MO229 / WEEC

MO229 / WEED-3

0.40 BSC

- - - -

0.20±0.05

2.40 REF

T1433-2

14

2.30±0.10

1.70±0.10

T633-2

6

1.50±0.10

2.30±0.10

0.95 BSC

MO229 / WEEA

0.40±0.05

1.90 REF

T833-2

8

1.50±0.10

2.30±0.10

0.65 BSC

MO229 / WEEC

0.30±0.05

1.95 REF

T833-3

8

1.50±0.10

2.30±0.10

0.65 BSC

MO229 / WEEC

0.30±0.05

1.95 REF

-DRAWING NOT TO SCALE-

H

2

2

21-0137

PACKAGE OUTLINE, 6,8,10 & 14L,

TDFN, EXPOSED PAD, 3x3x0.80 mm

2.30±0.10

MO229 / WEED-3

2.00 REF

0.25±0.05

0.50 BSC

1.50±0.10

10

T1033-2

Package Information (continued)

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information

go to

www.maxim-ic.com/packages.)