E6000 datasheet(21/122 Pages) INTEL

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Datasheet

Electrical Specifications

ICC

Processor Number

E6850

E6750

E6700

E6600

E6550

E6540

E6400/E6420

E6300/E6320

E4600

E4500

E4400

E4300

ICC for

775_VR_CONFIG_06

3.00 GHz

2.66 GHz

2.40 GHz

2.33 GHz

2.13 GHz

1.86 GHz

2.40 GHz

2.20 GHz

2.00 GHz

1.80 GHz

——

Processor Number

X6800

ICC for

775_VR_CONFIG_05B

2.93 GHz

——

VTT

FSB termination voltage

(DC + AC specifications)

1.14

1.20

1.26

VTT_OUT_LEFT

and

VTT_OUT_RIGHT

ICC

DC Current that may be drawn from

VTT_OUT_LEFT and VTT_OUT_RIGHT per

—

580

ITT

ICC for VTT supply before VCC stable

ICC for VTT supply after VCC stable

——

4.5

4.6

ICC_VCCPLL

ICC for PLL land

—

130

ICC_GTLREF

ICC for GTLREF

—

200

μA

NOTES:

1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data.

These specifications will be updated with characterized data from silicon measurements at a later date.

2. Adherence to the voltage specifications for the processor are required to ensure reliable processor operation.

3. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at

manufacturing and can not be altered. Individual maximum VID values are calibrated during manufacturing such

that two processors at the same frequency may have different settings within the VID range. Note this differs

from the VID employed by the processor during a power management event (Thermal Monitor 2, Enhanced Intel

SpeedStep® Technology, or Extended HALT State).

4. These voltages are targets only. A variable voltage source should exist on systems in the event that a different

voltage is required. See Section 2.3 and Table 2 for more information.

5. The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the socket

with a 100 MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance.

The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the

system is not coupled into the oscilloscope probe.

6. Refer to Table 6 and Figure 1 for the minimum, typical, and maximum VCC allowed for a given current. The

processor should not be subjected to any VCC and ICC combination wherein VCC exceeds VCC_MAX for a given

current.

7. ICC_MAX specification is based on the VCC_MAX loadline. Refer to Figure 1 for details.

8. VTT must be provided via a separate voltage source and not be connected to VCC. This specification is measured

at the land.

9. Baseboard bandwidth is limited to 20 MHz.

10.This is maximum total current drawn from VTT plane by only the processor. This specification does not include

the current coming from RTT (through the signal line). Refer to the Voltage Regulator-Down (VRD) 11.0

Processor Power Delivery Design Guidelines For Desktop LGA775 Socket to determine the total ITT drawn by the

system. This parameter is based on design characterization and is not tested.

Table 5.

Voltage and Current Specifications

Symbol

Parameter

Min

Typ

Max

Unit

Notes1, 2

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