3000 datasheet(4/102 Pages) INTEL

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Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

5.2.1

Thermal Monitor .....................................................................................80

5.2.2

Thermal Monitor 2 ..................................................................................81

5.2.3

On-Demand Mode...................................................................................82

5.2.4

PROCHOT# Signal ..................................................................................83

5.2.5

THERMTRIP# Signal ................................................................................83

5.3

Platform Environment Control Interface (PECI) ......................................................84

5.3.1

Introduction...........................................................................................84

5.3.1.1

Key Difference with Legacy Diode-Based Thermal Management .......84

5.3.2

PECI Specifications .................................................................................86

5.3.2.1

PECI Device Address..................................................................86

5.3.2.2

PECI Command Support .............................................................86

5.3.2.3

PECI Fault Handling Requirements ...............................................86

5.3.2.4

PECI GetTemp0() Error Code Support ..........................................86

6Features ..................................................................................................................87

6.1

Power-On Configuration Options ..........................................................................87

6.2

Clock Control and Low Power States.....................................................................87

6.2.1

Normal State .........................................................................................88

6.2.2

HALT and Extended HALT Powerdown States ..............................................88

6.2.2.1

HALT Powerdown State ..............................................................88

6.2.2.2

Extended HALT Powerdown State ................................................89

6.2.3

Stop Grant and Extended Stop Grant States ...............................................89

6.2.3.1

Stop Grant State .......................................................................89

6.2.3.2

Extended Stop Grant State .........................................................90

6.2.4

Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop

State, and Stop Grant Snoop State ...........................................................90

6.2.4.1

HALT Snoop State, Stop Grant Snoop State ..................................90

6.2.4.2

Extended HALT Snoop State, Extended Stop Grant Snoop State.......90

6.3

Enhanced Intel® SpeedStep® Technology ............................................................90

Boxed Processor Specifications................................................................................93

7.1

Mechanical Specifications....................................................................................94

7.1.1

Boxed Processor Cooling Solution Dimensions.............................................94

7.1.2

Boxed Processor Fan Heatsink Weight .......................................................95

7.1.3

Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....95

7.2

Electrical Requirements ......................................................................................95

7.2.1

Fan Heatsink Power Supply ......................................................................95

7.3

Thermal Specifications........................................................................................97

7.3.1

Boxed Processor Cooling Requirements......................................................97

7.3.2

Variable Speed Fan .................................................................................99

Debug Tools Specifications .................................................................................... 101

8.1

Logic Analyzer Interface (LAI) ........................................................................... 101

8.1.1

Mechanical Considerations ..................................................................... 101

8.1.2

Electrical Considerations ........................................................................ 101

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