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Balanced Technology Extended (BTX) Boxed Processor Specifications

Balanced Technology Extended

(BTX) Boxed Processor

Specifications

The Intel Pentium 4 processors will be offered as an Intel boxed processor. Intel boxed

processors are intended for system integrators who build systems from largely

standard components. The boxed Intel Pentium 4 processor will be supplied with a

cooling solution known as the Thermal Module Assembly (TMA). Each processor will be

supplied with one of the two available types of TMAs – Type I or Type II. This chapter

documents motherboard and system requirements for both the TMAs that will be

supplied with the boxed Pentium 4 processor in the 775-land package. This chapter is

particularly important for OEMs that manufacture motherboards for system integrators.

Figure 25 shows a mechanical representation of a boxed Pentium 4 processor in the

775-land package with a Type I TMA. Figure 26 illustrates a mechanical representation

of a boxed Pentium 4 processor in the 775-land package with Type II TMA.

Note:

Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and

inches [in brackets].

Note:

Drawings in this section reflect only the specifications on the Intel boxed processor

product. These dimensions should not be used as a generic keep-out zone for all

cooling solutions. It is the system designer’s responsibility to consider their proprietary

cooling solution when designing to the required keep-out zone on their system

platforms and chassis. Refer to the appropriate processor Thermal and Mechanical

Design Guidelines (see Section 1.2) for further guidance.

NOTE: The duct, clip, heatsink, and fan can differ from this drawing representation but

the basic shape and size will remain the same.

Figure 25.

Mechanical Representation of the Boxed Processor with a Type I TMA

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