© 2008 Microchip Technology Inc.

DS22062B-page 3

MCP14E3/MCP14E4/MCP14E5

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

Supply Voltage ................................................................+20V

8L-DFN .......................................................................

Note 3

8L-PDIP ........................................................................1.10W

8L-SOIC .....................................................................665 mW

†

Notice: Stresses above those listed under "Maximum

Ratings" may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at

those or any other conditions above those indicated in the

operational sections of this specification is not intended.

Exposure to maximum rating conditions for extended periods

may affect device reliability.

DC CHARACTERISTICS (NOTE 2)

Electrical Specifications: Unless otherwise indicated, T

Parameters

Sym

Min

Typ

Max

Units

Conditions

Input

Logic ‘1’, High Input Voltage

2.4

1.5

—

V

Logic ‘0’, Low Input Voltage

—1.3

0.8

V

Input Current

–1

—

1

µA

0V

≤ V

Input Voltage

-5

—

V

Output

High Output Voltage

—

—

V

DC Test

Low Output Voltage

—

—

0.025

V

DC Test

Output Resistance, High

—2.5

3.5

Ω

Output Resistance, Low

—2.5

3.0

Ω

Peak Output Current

—4.0

—

A

Latch-Up Protection With-

stand Reverse Current

—

>1.5

—

A

Duty cycle

≤ 2%, t ≤ 300 µs

Switching Time (Note 1)

Rise Time

—15

30

ns

Figure 4-1, Figure 4-2

Fall Time

—18

30

ns

Figure 4-1, Figure 4-2

Propagation Delay Time

—46

55

ns

Figure 4-1, Figure 4-2

Propagation Delay Time

—50

55

ns

Figure 4-1, Figure 4-2

Enable Function (ENB_A, ENB_B)

High-Level Input Voltage

1.60

1.90

2.90

V

Low-Level Input Voltage

1.30

2.20

2.40

V

Hysteresis

0.10

0.30

0.60

V

Enable Leakage Current

40

85

115

µA

ENB_A = ENB_B = GND

Propagation Delay Time

—60

—

ns

Figure 4-3

(Note 1)

Propagation Delay Time

—50

—

ns

Figure 4-3

(Note 1)

Note 1: Switching times ensured by design.

2: Tested during characterization, not production tested.

3: Package power dissipation is dependent on the copper pad area on the PCB.