TDA8034T_TDA8034AT

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© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 2.0. — 12 November 2010

13 of 29

NXP Semiconductors

TDA8034T; TDA8034AT

Smart card interface

If pin CMDVCCN is HIGH for more than 30 ms (card inactive), and if the card needs to be

activated at 3 V, the sequence shown in Figure 12 applies: pin CMDVCCN must be set

LOW for t1 (200

μs < t1 < 700 μs), and then HIGH for t2 (200 μs < t2 < 15 ms) before

going LOW.

9.

Limiting values

Remark: All card contacts are protected against any short-circuit to any other card

contact. Stress beyond the levels indicated in Table 5 can cause permanent damage to

the device. This is a short-term stress rating only and under no circumstances implies

functional operation under long-term stress conditions.

10. Thermal characteristics

001aal000

CMDVCCN

3 V or 5 V

3 V

t0

t1

t2

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

power supply voltage

−0.3

+6

V

supply voltage

−0.3

+4.6

V

interface supply voltage

−0.3

+4.6

V

input voltage

pins CMDVCCN, CLKDIV1, RSTIN, OFFN,

XTAL1, XTAL2, I/OUC

−0.3

+4.6

V

card contact pins PRESN, I/O, RST and

CLK

−0.3

+6

V

storage temperature

−55

+150

°C

total power dissipation

-

0.25

W

junction temperature

-

+125

°C

ambient temperature

−25

+85

°C

electrostatic discharge voltage

Human Body Model (HBM) on card pins I/O,

application

−6+6

kV

Human Body Model (HBM); all other pins

−2+2

kV

Machine Model (MM); all pins

−200

+200

V

Field Charged Device Model (FCDM);

all pins

−500

+500

V

Table 6.

Thermal characteristics

Symbol

Package name

Parameter

Conditions

Typ

Unit

SO16

thermal resistance from junction to ambient

in free air

94

K/W