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PBLS2004D датащи(PDF) 3 Page - NXP Semiconductors

номер детали PBLS2004D
подробное описание детали  20 V PNP BISS loadswitch
PDF  16 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

PBLS2004D датащи(HTML) 3 Page - NXP Semiconductors

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PBLS2004D_1
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01— 23 June 2005
3 of 16
Philips Semiconductors
PBLS2004D
20 V PNP BISS loadswitch
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
TR2; NPN resistor-equipped transistor
VCBO
collector-base voltage
open emitter
-
50
V
VCEO
collector-emitter voltage
open base
-
50
V
VEBO
emitter-base voltage
open collector
-
10
V
VI
input voltage
positive
-
+40
V
negative
-
−10
V
IO
output current
-
100
mA
ICM
peak collector current
tp ≤ 300 µs
-
100
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
[1] -
200
mW
Per device
Ptot
total power dissipation
[1] -
400
mW
[2] -
530
mW
[3] -
600
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
(1) Ceramic PCB, Al2O3, standard footprint
(2) FR4 PCB, mounting pad for collector 1 cm2
(3) FR4 PCB, standard footprint
Fig 1.
Power derating curves
Table 5:
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Tamb (°C)
0
160
120
40
80
006aaa414
0.4
0.2
0.6
0.8
Ptot
(W)
0
(1)
(2)
(3)



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