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SC4612HEVB датащи(PDF) 13 Page - Semtech Corporation |
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SC4612HEVB датащи(HTML) 13 Page - Semtech Corporation |
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13 / 18 page ![]() SC4612H 3 Applications Information (continued) PCB Layout Guidelines Careful attention to layout is necessary for successful implementation of the SC462H PWM controller. High switching currents are present in the application and their effect on ground plane voltage differentials must be understood and minimized. ) The high power section of the circuit should be laid out first. A ground plane should be used. The number and position of ground plane interruptions should not unnecessarily compromise ground plane integrity.Isolatedorsemi-isolatedareasoftheground plane may be deliberately introduced to constrain ground currents to particular areas; for example, the input capacitor and bottom FET ground. 2)The loop formed by the Input Capacitor(s) (Cin), the Top FET (Q), and the Bottom FET (Q2) must be kept as small as possible. This loop contains all the high current, fast transition switching. Connections should be as wide and as short as possible to minimize loop inductance. Minimizing this loop area will a) reduce EMI, b) lower ground injection currents, resulting in electrically “cleaner” grounds for the rest of the system and c) minimize source ringing, resulting in more reliable gate switching signals. 3) The connection between the junction of Q, Q2 and the output inductor should be a wide trace or copper region. It should be as short as practical. Since this connection has fast voltage transitions, keeping this connection short will minimize EMI. Also keep the Phase connection to the IC short. Top FET gate charge currents flow in this trace. 4) The Output Capacitor(s) (Cout) should be located as close to the load as possible. Fast transient load currents are supplied by Cout only, and therefore, connections between Cout and the load must be short, wide copper areas to minimize inductance and resistance. 5) The SC462H is best placed over a quiet ground plane area. Avoid pulse currents in the Cin, Q, Q2 loop flowing in this area. GND should be returned to the ground plane close to the package and close to the ground side of (one of) the output capacitor(s). If this is not possible, the GND pin may be connected to the ground path between the Output Capacitor(s) and the Cin, Q, Q2 loop. Under no circumstances should GND be returned to a ground inside the Cin, Q, Q2 loop. 6) Allow adequate heat sinking area for the power components. If multiple layers will be used, provide sufficent vias for heat transfer. Fig4: Current waveforms of buck power stage. |
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