RF3322 datasheet(14/14 Pages) RFMD

14 / 14 page

Preliminary

3-40

RF3322

Rev A2 010518

Special Handling Information for Shrunk Small

Outline Package (SSOP1-EPP) Products

These packages are considered JEDEC Level 5 for

moisture sensitivity and require special handling to

assure reliable performance.

The exposed copper slug on the bottom of the package

improves both thermal and electrical performance.

Since the RFIC is mounted directly on the thermal

slug, and the slug is soldered directly on the PCB, the

thermal resistance to the PCB is minimized. Also, the

RF ground for the amplifier is established through this

copper slug as it is soldered to the ground plane on the

PCB. This offers the least inductance ground path

available.

Care must be taken when soldering these packages to

the PCB. They are currently considered JEDEC Level

5 for moisture sensitivity. Therefore the parts must be

handled in a dry environment prior to soldering, as is

specified in the JEDEC specification. Specifically,

RFMD recommends the following procedure prior to

assembly:

1. Dry-bake the parts at 125°C for 24 hours minimum.

Note: the shipping tubes cannot withstand 125°C

baking temperature.

2. Parts delivered on tape and reel are already dry-

baked and dry-packed. These may be stored for up

to oneyear, butmustbeassembledwithin48hours

after opening the bag.

3. Assemble the dry-baked parts within two days of

removal from the oven.

4. During this two-day period, the parts must be stored

in humidity less than 60%.

IMPORTANT!

If the two-day period is exceeded, then this procedure

must be repeated prior to assembly.

RF3322 датащи(PDF) 14 Page - RF Micro Devices