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SN74LVC1G32 датащи(PDF) 2 Page - Texas Instruments

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номер детали SN74LVC1G32
подробное описание детали  SINGLE 2-INPUT POSITIVE-OR GATE
PDF  18 Pages
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI - Texas Instruments

SN74LVC1G32 датащи(HTML) 2 Page - Texas Instruments

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SN74LVC1G32
SINGLE 2-INPUT POSITIVE-OR GATE
SCES219O – APRIL 1999 – REVISED FEBRUARY 2007
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
Reel of 3000
SN74LVC1G32YZPR
_ _ _CG_
0.23-mm Large Bump – YZP (Pb-free)
SON – DRY
Reel of 5000
SN74LVC1G32DRYR
CG_
SN74LVC1G32DBVR
Reel of 3000
SN74LVC1G32DBVRE4
SOT (SOT-23) – DBV
C32_
SN74LVC1G32DBVRG4
Tube of 250
SN74LVC1G32DBVT
–40
°C to 85°C
SN74LVC1G32DCKR
Reel of 3000
SN74LVC1G32DCKRE4
SOT (SC-70) – DCK
SN74LVC1G32DCKRG4
CG_
SN74LVC1G32DCKT
Tube of 250
SN74LVC1G32DCKTE4
SN74LVC1G32DRLR
SOT (SOT-553) – DRL
Reel of 4000
CG_
SN74LVC1G32DRLRG4
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
• = Pb-free).
FUNCTION TABLE
INPUTS
OUTPUT
Y
A
B
H
X
H
X
H
H
L
L
L
LOGIC DIAGRAM (POSITIVE LOGIC)
2
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