Case Temperature − C

°

0

20

40

60

80

100

120

140

160

180

0

50

100

150

200

G002

S0417-01

1

2

3

4

8

7

6

5

V

CC1

0.1 F

m

2 mm

max.

from

V

CC1

OUTA

INB

OUTPUT

INPUT

GND1

ISO7421

V

CC2

0.1 F

m

2 mm

max.

from

V

CC2

INA

OUTB

OUTPUT

INPUT

GND2

ISO7420, ISO7420M

ISO7421, ISO7421M

www.ti.com

SLLS984D – JUNE 2009 – REVISED JULY 2010

PACKAGE THERMAL CHARACTERISTICS

(over recommended operating conditions unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

212

Junction-to-air thermal resistance

°C/W

122

Junction-to-board thermal resistance

37

°C/W

Junction-to-case thermal resistance

69.1

°C/W

Device power dissipation

390

mW

Input a 150-Mbps 50% duty-cycle square wave

(1)

Tested in accordance with the low-K or high-K thermal metric definitions of EIA/JESD51-3 for leaded surface-mount packages

Figure 6. Typical ISO7421 Application Circuit

Copyright © 2009–2010, Texas Instruments Incorporated

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Product Folder Link(s): ISO7420 ISO7420M ISO7421 ISO7421M