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TPS54521 датащи(PDF) 19 Page - Texas Instruments |
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TPS54521 датащи(HTML) 19 Page - Texas Instruments |
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19 / 35 page ![]() VSENSE COMP VOUT R8 R4 C4 C6 R9 Coea Roea gm 1300 mA/V 0.8 V Power Stage PH RESR CO RL b a c 12 A/V TPS54521 www.ti.com SLVS981 – JUNE 2010 During normal operation, the device implements current mode control which uses the COMP pin voltage to control the turn off of the high-side MOSFET and the turn on of the low-side MOSFET, on a cycle by cycle basis. Each cycle, the switch current and the current reference generated by the COMP pin voltage are compared. When the peak switch current intersects the current reference, the high-side switch is turned off. Low-side MOSFET overcurrent protection While the low-side MOSFET is turned on, its conduction current is monitored by the internal circuitry. During normal operation, the low-side MOSFET sources current to the load. At the end of every clock cycle, the low-side MOSFET sourcing current is compared to the internally set low-side sourcing current limit. If the low-side sourcing current is exceeded, the high-side MOSFET is not turned on and the low-side MOSFET stays on for the next cycle. The high-side MOSFET is turned on again when the low-side current is below the low-side sourcing current limit at the start of a cycle. The low-side MOSFET may also sink current from the load. If the low-side sinking current limit is exceeded, the low-side MOSFET is turned off immediately for the rest of that clock cycle. In this scenario both MOSFETs are off until the start of the next cycle. Furthermore, if an output overload condition (as measured by the COMP pin voltage) has lasted for more than the hiccup wait time which is programmed for 512 switching cycles, the device will shut down itself and restart after the hiccup time which is set for 16384 cycles. The hiccup mode helps to reduce the device power dissipation under severe overcurrent conditions. Thermal Shutdown The internal thermal shutdown circuitry forces the device to stop switching if the junction temperature exceeds 150°C typically. The device reinitiates the power up sequence when the junction temperature drops below 145°C typically. Small Signal Model for Loop Response Figure 30 shows an equivalent model for the device's control loop which can be modeled in a circuit simulation program to check frequency response and transient responses. The error amplifier is a transconductance amplifier with a gm of 1300mA/V. The error amplifier can be modeled using an ideal voltage controlled current source. The resistor Roea (2.38 M Ω) and capacitor Coea (20.7 pF) model the open loop gain and frequency response of the error amplifier. The 1-mV ac voltage source between the nodes a and b effectively breaks the control loop for the frequency response measurements. Plotting a/c and c/b show the small signal responses of the power stage and frequency compensation respectively. Plotting a/b shows the small signal response of the overall loop. The dynamic loop response can be checked by replacing the RL with a current source with the appropriate load step amplitude and step rate in a time domain analysis. Figure 30. Small Signal Model for Loop Response Simple Small Signal Model for Peak Current Mode Control Figure 31 is a simple small signal model that can be used to understand how to design the frequency compensation. The device's power stage can be approximated to a voltage controlled current source (duty cycle Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 19 Product Folder Link(s) :TPS54521 |
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