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LMP8645 датащи(PDF) 4 Page - National Semiconductor (TI) |
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LMP8645 датащи(HTML) 4 Page - National Semiconductor (TI) |
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4 / 16 page ![]() 12V Electrical Characteristics (Note 4) Unless otherwise specified, all limits guaranteed for at T A = 25°C, VS=V +-V-, V+ = 12V, V− = 0V, −2V < V CM < 76V, Rg= 25kΩ, RL = 10 M Ω. Boldface limits apply at the temperature extremes. Symbol Parameter Condition Min (Note 6) Typ (Note 5) Max (Note 6) Units V OS Input Offset Voltage V CM = 2.1V -1 -1.7 1 1.7 mV TCV OS Input Offset Voltage Drift(Note 7, Note 9) V CM = 2.1V 7 μV/°C I B Input Bias Current(Note 10) V CM = 2.1V 13 23 μA e ni Input Voltage Noise (Note 9) f > 10 kHz, R G = 5 kΩ 120 nV/ V SENSE(MAX) Max Input Sense Voltage(Note 9) V CM =12V, RG = 5 kΩ 600 mV Gain A V Adjustable Gain Setting (Note 9) V CM = 12V 1 100 V/V Gm Transconductance V CM = 2.1V 200 µA/V Accuracy V CM = 2.1V -2 -3.4 2 3.4 % Gm drift (Note 9) −40°C to 125°C, V CM =2.1V 140 ppm /°C PSRR Power Supply Rejection Ratio V CM =2.1V, 2.7V <V + < 12V 90 dB CMRR Common Mode Rejection Ratio LMP8645HV 2.1V <V CM < 76V LMP8645 2.1V <V CM< 42V 95 dB –2V <V CM < 2V 60 BW −3 dB Bandwidth (Note 9) R G = 10 kΩ, CG = 4 pF VSENSE = 400 mV, C L = 30 pF, RL= 1MΩ 860 kHz R G = 25 kΩ, CG = 4 pF, VSENSE = 400 mV, C L = 30 pF, RL= 1MΩ 260 R G = 50 kΩ, CG = 4 pF, VSENSE =400 mV, C L = 30 pF, RL= 1MΩ 140 SR Slew Rate(Note 8, Note 9) V CM = 5V, CG = 4 pF, VSENSE from 100 mV to 500 mV, C L = 30 pF, RL=1MΩ 0.6 V/µs I S Supply Current V CM = 2.1V 555 765 920 uA V CM = −2V 2200 2900 3110 V OUT Maximum Output Voltage V CM = 12V, RG= 500kΩ 10.2 V Minimum Output Voltage V CM = 2.1V 24 mV I OUT Output current (Note 9) Sourcing, V OUT= 5.25V, Rg= 150kΩ 5 mA Sinking, V OUT= 5.25V, Rg= 150kΩ 5 C LOAD Max Output Capacitance Load (Note 9) 30 pF Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics Tables. Note 2: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC) Field- Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T J(MAX), θJA, and the ambient temperature, TA. The maximum allowable power dissipation P DMAX = (TJ(MAX) - TA)/ θJA or the number given in Absolute Maximum Ratings, whichever is lower. Note 4: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that T J = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > T A. Note 5: Typical values represent the most likely parametric norm at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material. Note 6: All limits are guaranteed by testing, design, or statistical analysis. Note 7: Offset voltage temperature drift is determined by dividing the change in V OS at the temperature extremes by the total temperature change. www.national.com 4 |
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