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DSM2180F3 датащи(PDF) 57 Page - STMicroelectronics |
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DSM2180F3 датащи(HTML) 57 Page - STMicroelectronics |
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57 / 63 page ![]() Obsolete Product(s) - Obsolete Product(s) 57/63 DSM2180F3 PACKAGE MECHANICAL In order to meet environmental requirements, ST offers the DSM2180F3V in ECOPACK® packag- es. These packages have a Lead-free second-lev- el interconnect. The category of second-level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Stan- dard JESD97. The maximum ratings related to soldering condi- tions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK speci- fications are available at: www.st.com. PLCC52 – 52 lead Plastic Leaded Chip Carrier, rectangular Note: Drawing is not to scale. PLCC52 – 52 lead Plastic Leaded Chip Carrier, rectangular Symbol mm inches Typ. Min. Max. Typ. Min. Max. A 4.19 4.57 0.165 0.180 A1 2.54 2.79 0.100 0.110 A2 – 0.91 – 0.036 B 0.33 0.53 0.013 0.021 B1 0.66 0.81 0.026 0.032 C 0.246 0.261 0.0097 0.0103 D 19.94 20.19 0.785 0.795 D1 19.05 19.15 0.750 0.754 D2 17.53 18.54 0.690 0.730 E 19.94 20.19 0.785 0.795 E1 19.05 19.15 0.750 0.754 E2 17.53 18.54 0.690 0.730 PLCC-B D E1 E 1 N D1 CP b D2/E2 e b1 A1 A A2 D3/E3 M L1 L C M1 |
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