3

Interconnect Solutions

http://www.3M.com/interconnects/

3M is a trademark of 3M Company.

For technical, sales or ordering information call

800-225-5373

Normal Polarization, Push-Push, Surfacemount

2900 Series

Physical

Electrical

Environmental

*"RoHS compliant" means that the product or part does not contain any of the following substances in excess of the following maximum concentration values

in any homogeneous material, unless the substance is in an application that is exempt under RoHS: (a) 0.1% (by weight) for lead, mercury, hexavalent

chromium, polybrominated biphenyls or polybrominated diphenyl ethers; or (b) 0.01% (by weight) for cadmium. Unless otherwise stated by 3M in writing,

this information represents 3M's knowledge and belief based upon information provided by third party suppliers to 3M.

microSD is a trademark of SD Association in Japan.

Insulation

Material: High Temperature Thermoplastic

Flammability: UL 94V-0

Color: Black

Contact Material: Copper Alloy

Plating

Underplating: 50

μ″ [ 1.27 μm ] min. Nickel

Wiping Area: 15

μ″ [ 0.38 μm ] min. Gold

Termination Area: 3

μ″ [ 0.076 μm ] max. Gold flash

Cover Material: Stainless Steel

Underplating: 40

μ″ [ 1.02 μm ] min. Nickel

Solder Area: Gold flash

Lock Pin and Link Pin Material: Stainless Steel

Spring Material: Copper Alloy

Plating: 30

μ″ [ 0.762 μm ] min. Nickel

Marking: 3M Logo

Current Rating

: 0.5 A

Insulation Resistance:

Withstanding Voltage:

500 VAC for one minute

Operating Temperature:

-25

°C to +85°C

Storage Temperature: -40

°C to +85°C

Process Rating: Maximum 250

°C, with 40 seconds over 230°C

TS-2197-02

Sheet 1 of 3

• 1.85 mm low profile height

• Small size of 14.0 mm × 14.2 mm footprint

• Smooth push–push eject mechanism

• Card is retained when mated

• Card polarization

• Will accept a card thickness of 0.8 mm

• Mechanism prevents card from flying out upon

ejection

• Card detection indicator

• Metal–shielded cover

• microSD™ specification compliant

• RoHS* compliant

Date Modified: October 31, 2006