21

Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted

in the quality certifications found at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications

at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by

Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any

infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any

patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

FN6631.2

April 8, 2010

For additional products, see www.intersil.com/product_tree

Products

Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The

Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones,

handheld products, and notebooks. Intersil's product families address power management and analog signal

processing functions. Go to www.intersil.com/products for a complete list of Intersil product families.

*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device

information page on intersil.com: ISL28107 and ISL28207.

To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff

FITs are available from our website at http://rel.intersil.com/reports/search.php

Revision History

The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to

Web to make sure you have the latest Rev.

DATE

REVISION

CHANGE

3/9/10

FN6631.2 1. Added MSOP package to the ordering information and added applicable POD M8.118 to end of

datasheet

2. Separated each part number with it's own specific -T7 and -T13 suffix. Removed “Add

“-T7” or “-T13” suffix for Tape and Reel.” from Note 1.

3. Added MSOP to the Pin Configuartion and Pin Descriptions

4. Updated ±15 and ±5V Electrical Specification table with the following edits:

A) Separated VOS specs for SOIC and MSOP packages. Added new VOS specs for MSOP Grade

package.

B) Separated TCVOS specs for SOIC and MSOP packages. Added new TCVOS specs for MSOP

package.

5. Added Theta JA and JC for the 8 Ld MSOP package. Added Theta JC values for both SOIC package

options. Changed Theta JA for 8 Ld SOIC (ISL28207) from 115 to 105.

2/22/10

1. Added “Related Literature*(see page 21)” on page 1.

2. Added Evaluation Boards to “Ordering Information” on page 2.

bolded, per note in common conditions)

11/10/09

FN6631.1 1. Updated VOS, IB, and IOS electrical specifications.

2. Added Typical performance curves, Figures 1 through 30.

3. Output Short Circuit Current test condition has been clarified with Note 7.

4. Updated POD.

5. Added Spice Model, associated text and Figures 56 through 66.

6. Deleted old figures 6, 7, 8, 10, 11 and 12.

7. Added Licence Statement on page 16 and referenced in spice model.

6/5/09

FN6631.0 Initial Release.

ISL28107, ISL28207